Saturday, November 29, 2014

Diamond wire for silicon bricking and cropping/slicng


















Diamond wire enables  bricking and cropping output increased.
Diamond wire is suitable to convert existing slurry saws with process support.
1. Reduced cut times
2. Cleaner and easier cooperation
3. Lower cost of ownership than comparable slurry-based systems
4. Increased productivity
5. Remarkable cutting accuracy
6. Stable, repeatable process
7. Potential kerf recycling


Products Specifications: 
Diametermm
Core Wiremm
Tolerance±mm
Break TensionN
Spool Wire Tension at Winding  (N) 
Pitchmm
0.35crinkle
0.25
0.02
≥150
15±1
0.5-0.6
0.35
0.25
0.02
≥160
15±1
0.5-0.6
0.37
0.27
0.02
≥190
15±1
0.5-0.6


Applied Case: 
Machine Manufacturer
Machine Model
HCT
HCT squarer DM
Shanghai Nissin
NWSS-125G
Meyer Burger
BM850

Diamond wire cutting results:
Capacity
Diamond Wire
Cutting time per ingot
2:35 hours
Downtime between cuts:
0:20 hours
Precision
Surface roughness
ra    <     3     μm
Tolerance
± 0.25 mm (³)
Parallelity / flatness
0.25 mm
TTV
0.5 mm
Perpendicularity
90° ± 0.2°
* Brickmaster BM 850

Bricking comparison: Slurry versus Diamond Wire
Feature
Slurry
Diamond Wire
Maximum Feed Rate:
0.8 mm/min
2.0 - 3 mm/min*
Cutting time - 250 mm ingot height
6.4 hours (400 minutes)
2.6 hours (150 minutes)
Capacity - G5 ingot, 156 x 156, 25 bricks/ingot
3.3 cuts/day ; 92 bricks/day
8.3 cuts/day ; 207 bricks/day
Capacity - 125 x 125 mm
7800 wafers/day
16100 wafers/day
Heat Induction
40° - 60° C
< 20° C
*dependent on ingot quality
www.chuck-talbe.com

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