Diamond wire for silicon wafering

The use of diamond wire for cutting silicon wafes is much more efficient than traditional cutting method.The following benfits can be achieved when using diamond wire cutting technology and related products.   1.2 times faster than slurry;   2.Faster return on  investment;   3. Increased capacity without increasing capital expenditures;   4.Lower cost/wafer resulting from reduced TCO;   5.Less expensive secondary process costs;   6. Reduced running costs such as electricity and cooling water;   7.No slurry mixing or supply and recovery systems required;   8.Improved TTV;   9.Reduced bow and warp;   10.Holistic approach to cutting;   11.Enhanced RA surface finish reduces secondary processes;   12.Excellent cutting accuracy;   13.No PEG and SiC hazardous waste management;   14.Cleaner and faster process.  Products Specifications: Diameter（mm） Core Wire（mm） Tolerance（±mm） Break Tension（N） Spool Wire Tension at Winding（N） Pitch（mm） 0.12 0.10 0.005 ≥30 10±1 0.5-0.6 0.14 0.12 0.005 ≥40 10±1 0.5-0.6 Applied Case:  Machine Manufacturer Machine Model NTC MWM-442DM Meyer Burger DS264 Wafering throughput comparison: Feature Slurry Diamond Wire Feed Rate: e.g. 0.42 mm/min e.g. 1.0 mm/min Cutting time - 156 x 156 mm 6.8 hours 3.6 hours Cutting time - 125 x 125 mm 5.6 hours 2.6 hours Capacity - 156 x 156 mm 6500 wafers/day 13800 wafers/day Capacity - 125 x 125 mm 7800 wafers/day 16100 wafers/day Heat Induction 40 - 60 °C <20 °C *calculation basis: DS 264; loading length = 800mm; wafer thickness = 0.180mm; (core) wire thickness = 0.120mm  Silicon Wafer Result Cut by DIAT Electroplated Diamond Wire Cutting  Material Wafer Thickness TTV Warp Saw Mark 125×125mm Monocrystailline Ingot 180±20μm ≤30μm ≤50μm ≤15μm 156×156mm  Monocrystalline Ingot 180±20μm ≤30μm ≤50μm ≤15μm

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Diamond wire for silicon filament cutting

Diamond wire for silicon filament cutting

Product benefits: Fast cut times; Increased capacity without increasing capital expenditures; Faster ROI due to reduced initial capital investment; Excellent cutting accuracy; Product specification: Diameter（mm） Core Wire（mm） Tolerance （±mm） Break Tension （N） Spool Wire Tension at Winding（N） Pitch （mm） 0.31 0.22 0.02 ≥140 15±1 0.5-0.6  Applied Case: Machine Manufacturer Machine Model DMT SR200 www.chuck-table.com

Diamond wire for silicon bricking and cropping/slicng

Diamond wire enables  bricking and cropping output increased. Diamond wire is suitable to convert existing slurry saws with process support. 1. Reduced cut times 2. Cleaner and easier cooperation 3. Lower cost of ownership than comparable slurry-based systems 4. Increased productivity 5. Remarkable cutting accuracy 6. Stable, repeatable process 7. Potential kerf recycling Products Specifications:  Diameter（mm） Core Wire（mm） Tolerance（±mm） Break Tension（N） Spool Wire Tension at Winding  (N)  Pitch（mm） 0.35（crinkle） 0.25 0.02 ≥150 15±1 0.5-0.6 0.35 0.25 0.02 ≥160 15±1 0.5-0.6 0.37 0.27 0.02 ≥190 15±1 0.5-0.6 Applied Case:  Machine Manufacturer Machine Model HCT HCT squarer DM Shanghai Nissin NWSS-125G Meyer Burger BM850 Diamond wire cutting results： Capacity Diamond Wire Cutting time per ingot 2:35 hours Downtime between cuts: 0:20 hours Precision Surface roughness ra    <     3     μm Tolerance ± 0.25 mm (³) Parallelity / flatness 0.25 mm TTV 0.5 mm Perpendicularity 90° ± 0.2° * Brickmaster BM 850 Bricking comparison: Slurry versus Diamond Wire Feature Slurry Diamond Wire Maximum Feed Rate: 0.8 mm/min 2.0 - 3 mm/min* Cutting time - 250 mm ingot height 6.4 hours (400 minutes) 2.6 hours (150 minutes) Capacity - G5 ingot, 156 x 156, 25 bricks/ingot 3.3 cuts/day ; 92 bricks/day 8.3 cuts/day ; 207 bricks/day Capacity - 125 x 125 mm 7800 wafers/day 16100 wafers/day Heat Induction 40° - 60° C < 20° C *dependent on ingot quality

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